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Thermally Conductive Materials

Thermally conductive materials include thermal pads and thermally conductive epoxy.

ATCR1R5 series thermal pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -40~150ºC. The flame rating is UL94 V0.

Material: Silicon gel &ceramic
Color: Dark gray
Density: 2.5 g/cc
Dielectric coefficient: 5.75 @1MHZ

PHOTO PART #  SIZE (mm) THERMAL CONDUCTIVITY WORKING TEMP.

ATCR1R5-0.5

Thermal pad

200×200×0.5 1.5 W/m.k -40 ~ 150°C

ATCR1R5-1.0

Thermal pad

 200×200×1.0  1.5 W/m.k -40 ~ 150°C

ATCR1R5-1.5

Thermal pad

200×200×1.5 1.5 W/m.k -40 ~ 150°C

ATCR1R5-2.0

Thermal pad

200×200×2.0 1.5 W/m.k -40 ~ 150°C
 

ATCR1R5-2.5

Thermal pad

200×200×2.5 1.5 W/m.k -40 ~ 150°C
 

ATCR1R5-3.0

Thermal pad

200×200×3.0 1.5 W/m.k -40 ~ 150°C

ATCR1R5-3.5

Thermal pad

200×200×3.5 1.5 W/m.k -40 ~ 150°C

ATCR1R5-4.0

Thermal pad

200×200×4.0 1.5 W/m.k -40 ~ 150°C

ATCR1R5-4.5

Thermal pad

200×200×4.5 1.5 W/m.k -40 ~ 150°C

ATCR1R5-5.0

Thermal pad

200×200×5.0 1.5 W/m.k -40 ~ 150°C

ATCR1R5-8.0

Thermal pad

200×200×8.0 1.5 W/m.k -40 ~ 150°C

ATEE2850

Thermally Conductive Epoxy

 1.28 W/m.k -55 ~ 155°C 

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