Based on the Peltier effect, thermoelectric cooler (TEC) is an energy conversion process, which uses electric energy as power. When the direct current is through the loop made of two different conductive materials, the endothermic phenomenon will be generated in the node, and when the current is in the opposite direction, the exothermic phenomenon will be generated.(more)
TEC (Thermo-Electric Cooler) temperature controllers have some unique and important features that other temperature controllers do not have. One of the key features of TEC controller offers is that it allows the target object reaching the set-point temperature in a short time. Let's use a 20×20×10 (mm) object as an example, driving a TEC with a TEC controller can allow the object reaching the set-point temperature within 5 seconds understand either cooling or heating mode, as the set-point temperature changes 1C. But if we drive a heater unit with a heater controller, it may take > 30 seconds to reach the same temperature under the heating mode, > 60 seconds under the cool-down mode. Another key feature of the TEC controller is that it can maintain the object temperature to be very close to the desired temperature, such as within 0.001C of set-point temperature. To summarize, these are the key features of the TEC controller:(more)
The forms of thermal conductivity silicone are grease and solid. And there are also many different kinds of materials can be competent forapplicationsof the thermal conductivity silica. When producing thermal silica, there are some factors to consider.(more)
Based on the Piltier effect, thermoelectric cooling is an energy conversion process, using electric energy as power, that is: when the direct current is through two different conductive materials, nodes will have endothermic phenomenon (when the current is in the opposite direction, exothermic phenomenon will be generated). As the Peltier effect of semiconductor materials is very obvious, the thermoelectric modules are mostly made up of semiconductor materials at home and aboard.(more)
Thermal pad has good heat conduction ability and high level pressure-tolerant, and it is the substitute of thermal grease. Because of having certain flexibility, it has good bonding between a power device and an aluminum heat sink, so it can achieve the best purpose of heat conduction and heat dissipation. In the industry, thermal pad is also called the thermal silica film, thermal conductive silicone pad, insulating heat conducting sheet, soft cooling pad and so on.(more)
Laser is a kind of light source components. In actually, drive circuit refers to modulation circuit of light source device, which plays a role of converting digital signal to optical pulse signal and then sending to fibers. This part is the core of optical transmitter, which decides many important technical parameters.(more)
More recently high-power laser diodes operating in the wavelength range of about 0.8–1.1 micron have been getting much attention due to their widespread applications. These lasers are used in optical pumping of solid-state lasers, such as the Nd: YAG, replacing traditional flash lamp designs. High-power laser diodes are tuned to the absorption band of the dielectric crystal resulting in much more efficient pumping of the laser rod, from which a high-power focused coherent beam of light is emitted. This beam can then be used in a variety of industrial, medical, and military applications. Laser diodes have been developed to match the absorption bands of a variety of dielectric crystals in a broad wavelength range. Figure 6 shows two common variations of high-power laser diode packages.(more)
With the development of science and technology, laser technology has been used in many fields, such as national economy, national defense construction and so on. And it has wide applications in long-distance communications, digital signal storage and recovery, laser ranging, robotics, holographic application, medical diagnosis, etc.(more)
The maximum temperature difference of a single-stage thermoelectric cooler with a standard can reach about 72℃. Some TEC can be stacked together by using mechanical method: the cold side surface of one TEC is installed on the hot side surface of another TEC, so the maximum temperature difference can reach 130℃. This stacking is called the cascade or multi-stage cooler layout. In general, multi-stage cooler has the shape of Pyramid, and a high level volume of TEC is smaller than the low level volume. However, regardless of the shape and the size, the low level TEC need to have a greater cooling capacity than the high level TEC do. Although currently, we have the ability to manufacture more than six or seven level multi-stage TEC, we generally use the two to fourlevel layouts.(more)
c) In order to avoid TECs losing effect due to obvious mechanical vibration, do not place any large mass device without support on the cold end of TECs. When involving lass mass device, it's better to use chucking to fix the TECs between heat sinks and the object. Or place the device on a cold plate that can be media at first. At this time, damping screws can effectively increase the shear strength of the whole mechanical system.(more)
